LOAN AND SECURITY AGREEMENT
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THIS LOAN AND SECURITY AGREEMENT (this “Agreement”) is entered into as of 8/17/2026, 2026 (the “Effective Date”), by and between AMERICAN INDUSTRIAL TECHNOLOGIES, INC., a Nevada corporation with its principal place of business at 7651 Southland Boulevard, Orlando, Florida 32809 (the “Lender”), and CLEAR RF LLC, a Washington limited liability company (the “Borrower”). The Lender and the Borrower are each a “Party” and together the “Parties.”
RECITALS
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WHEREAS, the Borrower designs and supplies rugged push-to-talk mobile devices, including the models designated SD7 Ultra and SD9 (each, a “Device”);
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WHEREAS, Q1 (as defined below), an affiliate of the Lender, purchases Devices from the Borrower for resale;
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WHEREAS, the Borrower requires financing to procure the chipsets, memory and other components necessary to manufacture 4,000 units of the SD7 Ultra and 3,000 units of the SD9 (together, the “Financed Units”) for sale to Q1;
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WHEREAS, the Lender is willing to advance to the Borrower the principal sum of Three Million and 00/100 Dollars ($3,000,000.00) upon the terms and conditions set forth in this Agreement, secured by the Collateral and supported by the Guarantees; and
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WHEREAS, in consideration of the Lender extending the Loan, the Borrower has agreed to the reduced transfer prices set forth on Schedule 1 with respect to the Financed Units.
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